LNK6665V

LinkSwitch - HP series flyback power supply IC integrated the primary side voltage stability in a wrapper (PSR) controller and high-voltage power MOSFET.The IC products provided by the device can be within the scope of the 9 W to 90 W power provides extremely strict constant voltage (CV).LinkSwitch - HP IC controller has many features: + / - 5% of the constant voltage (CV) accuracy;Optional current-limiting point;Programmable hysteresis or latch shut off output overvoltage protection (OVP), under-voltage protection (UVP) and overvoltage protection (OTP);The improved under different input voltage, overload power compensation;Fast AC reset;And programmable shut off delay time.

The product features

EcoSmart, high efficiency and energy saving

• Multi-mode control can improve the efficiency of the entire load range
• In the 230 VAC input load power consumption is lower than 30 mW of time and space
• At 230 VAC input and 1 W power input efficiency > 75%
• In the 230 VAC input and 0.1 W input power efficiency > 50%

Improve the design flexibility, reduce the system cost

• Can greatly simplify the power supply design
• 132 kHz work frequency can reduce the size of the transformer and power supply
• Can realize precise flow programming
• The frequency modulation technology can reduce the cost of EMI filter element
• Fully integrated soft start circuit can reduce the device's start of stress
• 725 V MOSFET can simplify the design, easily meet the requirements of derating (LNK677x)
• 650 V MOSFET can achieve minimum system cost (LNK676x/LNK666x)
• Optional quick transient response products (LNK666x)

Comprehensive protection function

• Output short circuit protection (SCP)
• Output overload/over-current protection (OCP) composition among OPP,
• Optional shut off delay time extended
• Output overvoltage protection (OVP), delay or latches
• Voltage slow rise/fall protection (input undervoltage)
• Input overvoltage (OV) shut off enhanced tolerance to input surge
• Accurate thermal shut off (OTP), delay or latch

Advanced green packaging options

• ESIP - 7 c encapsulation:
  • The characteristics of vertical packaging can reduce PCB footprint size
  • Using clip or bonding pad can simplify the installation of radiator
• The eSOP - 12 b package:
  • Ultra-thin SMT products suitable for ultra-thin design
  • By bare gasket and conducts heat source pins to the PCB
  • Support for wave soldering and reflow soldering
• EDIP - 12 b package:
  • Thin hole is installed for ultra-thin design
  • Heat through naked bonding pad or optional metal heat sink to PCB
• Increase the creepage distance to the drain pins
• Radiator are connected to the source, reducing EMI
• Halogen free and comply with RoHS

application

• LCD display and a TV set
• The adapter
• Electrical appliances
• An embedded power supply, set-top boxes, DVD)
• Industrial control